PIC-E RA WITH REAR HSG DIP3.10 X1
PRODUCT MATERIAL NUMBER: K80100389
PRODUCT OVERVIEW: PCI-E GEN3
COMPONENT TYPE: R/A RECEPTACLE
PCB MOUNT TYPE: DIP
ORIENTATION: HERIZONTAL
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K80100389
产品参数
PHYSICAL CHARACTERISTICS | ||
| PLATING MATERIAL ON CONTACT AREA: | Au | |
| PLATING THICKNESS ON CONTACT AREA: | 15u | |
| CIRCUITS: | 36PIN | |
| PITCH: | 1.0mm | |
| DURABILITY: | 50CYCLES | |
| HOUSING: | HIGH TEMP THERMOPLASTIC BLACK | |
| ELECTRICAL CHARACTERISTICS | ||
| CURRENT RATING: | 1.1A | |
| VOLTAGE RATING: | 50V AC | |
| SOLDER PROESS CHARACTERISTICS | ||
| SOLDER PROESS TYPE: | IR REFLOW | |
| MAX.PROESS TEMPERATURE: | 260℃ | |
| DURATION AT MAX.PROCESS TEMPERATURE: | 10S | |
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