MICRO FIT POWER WAFER

MICRO FIT POWER WAFER
3.0PH RA L3.2 2*4 10PIN

PRODUCT MATERIAL NUMBER: D80103228

PRODUCT OVERVIEW: MICRO FIT POWER WAFER

COMPONENT TYPE: RA RECEPTACLE

PCB MOUNT TYPE: SMT

ORIENTATION: HERIZONTAL

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二维码

D80100103

产品参数

PHYSICAL CHARACTERISTICS

PLATING MATERIAL ON CONTACT AREA:
Sn
PLATING THICKNESS ON CONTACT AREA:100u
CIRCUITS: 2*4 8PIN 
PITCH:  3.0mm
DURABILITY: 2000CYCLES
HOUSING:  

PA6T BLACK

ELECTRICAL CHARACTERISTICS
CURRENT RATING: 

5.0A

MAX. VOLTAGE:250V
SOLDER PROESS CHARACTERISTICS
SOLDER PROESS TYPE:  IR REFLOW
MAX.PROESS TEMPERATURE:  260℃
DURATION AT MAX.PROCESS TEMPERATURE:  10S