PIC-E RA WITH REAR HSG DIP2.3 X16
PRODUCT MATERIAL NUMBER: K80100399
PRODUCT OVERVIEW: PCIe GEN3
COMPONENT TYPE: SLOT
PCB MOUNT TYPE: DIP
ORIENTATION: HORIZONTAL
SHARE：
K80100399
产品参数
PHYSICAL CHARACTERISTICS | ||
| PLATING MATERIAL ON CONTACT AREA: | Au | |
| PLATING THICKNESS ON CONTACT AREA: | 15u | |
| CIRCUITS: | 164PIN | |
| PITCH: | 1.0mm | |
| DURABILITY: | 50CYCLES | |
| HOUSING: | HIGH TEMP THERMOPLASTIC BLACK | |
| ELECTRICAL CHARACTERISTICS | ||
| CURRENT RATING: | 1.1A | |
| VOLTAGE RATING: | 500V AC | |
| SOLDER PROESS CHARACTERISTICS | ||
| SOLDER PROESS TYPE: | IR REFLOW | |
| MAX.PROESS TEMPERATURE: | 260℃ | |
| DURATION AT MAX.PROCESS TEMPERATURE: | 10S | |