PIC-E RA WITH REAR HSG DIP3.10 X8

PIC-E RA WITH REAR HSG DIP3.10 X8

PRODUCT MATERIAL NUMBER: K80100391

PRODUCT OVERVIEW: PCIe GEN3  

COMPONENT TYPE: R/A RECEPTACLE

PCB MOUNT TYPE: DIP

ORIENTATION: HERIZONTAL

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K80100391

产品参数

PHYSICAL CHARACTERISTICS

PLATING MATERIAL ON CONTACT AREA:
Au
PLATING THICKNESS ON CONTACT AREA:15u
CIRCUITS: 98PIN
PITCH:  1.0mm
DURABILITY: 50CYCLES
HOUSING:  

HIGH TEMP THERMOPLASTIC BLACK

ELECTRICAL CHARACTERISTICS
CURRENT RATING: 

1.1A

VOLTAGE RATING:500V AC
SOLDER PROESS CHARACTERISTICS
SOLDER PROESS TYPE:  IR REFLOW
MAX.PROESS TEMPERATURE:  260℃
DURATION AT MAX.PROCESS TEMPERATURE:  10S